In the filed of electronic manufacturing, PCB assemble like a micron level precise dance,put hundreds of micro components to assemble on the curcuit board with exacting accuracy, during this high automotive production process, condensed into intelligence of modern manufacturing

Firstly: Prelude Process Preparation

The SMT process begins strict preparation of material. SMT line verifies the Bom list first, use optical test equipment to scan PCB pads with micron level,to insure solder mask thinckness is controlled within 15-25μm. Meanwhile, the stencil printing apertures are chosed to Opening a hole based on the components space, 0402 footprint components require stencil thickness to be accurate 0.1mm level.

Secondly, Core process precision placement

Fully automatic pick and place machine run with the speed of 20 components per second,high precision machine repeat placement achieve ±25μm, double rail SMT line use vision placement system, through CCD camera to capture mark Coordinate to compensate displacement causing by PCB thermal deformation. As for special packages like QFN, equipment will start 3D laser inspection module, to insure pin Coplanarity error no more than 0.05mm

Third:Inspection art

Reflow soldering, AOI inspection will scan the solder point at the resolution of 0.01mm/pixel,Algorithm can identify 27 defects like Tombstone effect,Seok-joo inside, the latest 3D SPI system can measure solder paste shape, achieving±1μm for inspection  0201 components solder joint detection accuracy, ensuring welding reliability

This production system made by precision equipment play a role of ultimate pursuit modern electronic manufacturing, from medical to space instrument, because of this precision SMT process, supporing the basic varities electronic instrument stable operation, along with 5G times with size shrink of components,SMT technology is breakthrough into more microscopic filed