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Quality Inspection

We use advanced MES for production line control ,with Fuji NXT,MPM, JUKI, Desen, Suneast and other industry professional equipment, which covers automatic surface mount system , reflow soldering, automatic testing and packaging processes,and production workshop using a fully enclosed air-conditioning system ,temperature and humidity and lighting intensity control ,high standards of electrostatic protection managerment.

TS16949
IPC-A-600F
ISO9001

98%

Delivery On Time Rate

99%

Inspection Pass Rate
  • Visual inspection
  • X-ray Inspection
  • 3D AOI Testing
  • ICT (In-Circuit Test)
  • FAI
  • AOI Testing
  • 3D SPI Testing
  • Functional Test

3D SPI Testing

3D solder paste inspection, also called SPI is a technique for testing printed circuit boards to make sure that they are printed correctly. You use a machine to monitor the solder paste alignment and volume during the printing process.

3D SPI (Solder Paste Inspection) testing is a process used to inspect and verify the quality of the soldering process in the manufacturing of electronic devices. Solder paste is a material used to join electronic components to a printed circuit board (PCB) during the manufacturing process. 3D SPI testing is a non-destructive inspection method that uses a 3D imaging system to examine the soldering process and identify any defects or issues.

During 3D SPI testing, the soldering process is examined at various stages, including the application of the solder paste, the placement of the electronic components, and the soldering process itself. The 3D imaging system captures high-resolution images of the soldering process, which are then analyzed to identify any defects or issues.

3D SPI testing is an important quality control step in the manufacturing process because it helps to ensure that the soldering process is accurate and reliable. It can help to identify and address any issues early on, which can save time and resources by preventing the production of defective products.

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