IC Substrates manufacturer
IC substrates are specialized printed circuit boards (PCBs) designed to support and interconnect integrated circuits (ICs). In addition to smartphones, tablets, laptops, and other portable devices, IC substrates are used in automotive, military, and aerospace applications.
Committed to Manufacturing Solutions
To support the high-density interconnections and performance requirements of ICs, IC substrates are typically made using advanced manufacturing techniques and materials such as multilayer construction, laser drilling, and micro vias. They may also be built with advanced thermal management features, such as metal core materials, to dissipate heat generated by the ICs.
We can provide to...
- Turn times as short as 24 hours
- 1 to 100,000 units
- Class II Inspection standard and Class III Inspection available
- 100% on-time guarantee
- DFM support
- Lead free (RoHS) options
- SMT and thru-hole capabilities
- All SMT machine placed
- AOI (Automated Optical Inspection)
- Lead-free RoHS Certification and ITAR compliance screen available
flex Board Capability
PCB manufacturing Capabilities
From component purchasing to functional testing and package completion, we provide one-stop services for all types of PCBs.
Flexible payment options
No MOQ or MPQ limited. Prototype or mass production order acceptable.
Inspection Of Quality
90% of the technical staff have more than 10 years of industry experience
flex Board Capability
|Layer Count||1-6L 1-4 L normal|
|Board Thickness||0.1-0.5mm (1-4L) 0.6-0.8mm (5-6L)|
|The tolerance of 1L board thickness||±0.03mm|
|The tolerance of 2L board thickness||±0.03mm|
|The tolerance of multilayer board thickness||±10% (Normal ±0.1mm）|
|The tolerance of multilayer board thickness||±10% (Normal ±0.05mm）|
|The tolerance of board thickness||±10% (Normal ±0.1mm）|
|The tolerance of board thickness||9inch*23inch（PI≥1mil） 9inch*14inch (normal)|
|Max finished board size||2mm*4mm（no connection tab）；8mm*8mm（with connection tab）|
|Min finished board size||生益 SF305： PI=0.5mil， 1mil， 2mil； Cu=0.33OZ， 0.5OZ， 1OZ|
|Adhesive flex core||杜邦AP：PI=1mil，2mil，3mil,4mil；Cu=0.5oz，1oz, 2oz|
|Adhesiveless core||杜邦AP：PI=1mil，2mil，3mil,4mil；Cu=0.5oz，1oz, 2oz|
|PI stiffener||台虹 MHK 系列： PI=3mil， 5mil ， 7mil， 9mil|
|Finished copper thickness 12um / 18um||3/3mil|
|Finished copper thickness 35um||4/3.5mil|
|Finished copper thickness 70um||6/5mil|
|Solder mask bridge min. (copper thickness<=1oz)||4mil(Green)，5mil(White)，8.0mil（big copper area）|
|Solder mask opening (single side)||6mil，8mil（big copper area）|
|Solder mask opening of NPTH (single side)||3mil(partial2.5mil)|
|Min. coverlay bridge||8mil|
|Finished copper thickness 12um / 18um||5/5mil (after compensation)|
|Finished copper thickness 35um||6.5/5mil (after compensation)|
|Finished copper thickness 70um||10/8mil (after compensation)|
|Min. Inner layer annual ring width||4mil（＜4L），7mil（4-6L），9mil（7-8L）|
|The min distance between inner layer isolated pad and copper area||3.5mil 4mil normal|
|Max finished inner layer copper thickness||3oz 2 oz normal|
|Finished copper thickness, before compensation||3/3mil|
|Finished copper thickness 35um, before compensation||3.5/3.5mil|
|Finished copper thickness 70um, before compensation||5.5/5mil|
|Finished copper thickness 35um,||3mil（＜2mm）；4mil（2-4.5mm）|
|Finished copper thickness 35-70um,||5mil（＜2mm）；6mil（2-4.5mm）|
|Finished copper thickness >70um,||7mil（＜2mm）；10mil（2-4.5mm）|
|Min the distance between NPTH edge to external conductor before compensation||4oz 2 oz normal|
|Max finished external copper thickness||8mil 5mil（Gold finger area）|
|The max board thickness for 0.15mm drill bit||0.8mm|
|Min laser hole diameter||0.1mm|
|Min finish half PTH via diameter||0.3mm|
|Min NPTH tolerance||±2mil(limit+0，-2mil or +2mil，-0)|
|Min space between via hole walls in different net, before compensation||10mil(after compensation) 12mil (normal)(after compensation)|
|Tolerance of stiffener tape||±0.1mm (Normal ±0.2mm)|
|Tolerance of Coverlay||±2mil ((Normal ±4mil)|
|Min distance between coverlay opening and conduct||3mil ((Normal 4mil)|
PCB manufacturing Capabilities
|Normal Tg FR4(Halogen free)||Shengyi S1150|
|High Tg FR4(Halogen free)||Shengyi S1165|
|HDI PCB material||LDPP（IT-180A 1037,1086）、Normal 106,1080|
|High Tg FR4||Isola：FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR|
|Ceramic Particle Filled Laminates||Rogers：Rogers4350、Rogers4003;Arlon:25FR、25N;|
|Rigid PCB||Back board、HDI、|
|Blind&buried via type||Laminating≤3 times|
|Lead free||Flash gold、ENIG|
|Max finished size||HAL Leaded 22"*39"|
|MIN finished size||HAL Leaded 5"*6"|
|PCB thickness||HAL Leaded0.6-4.0mm；|
|MAX high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mi|
|Max lamination cycle||3 times|
|Min laser drill for stacked via||0.1mm|
|Min stacked via pad size||0.3mm|
|Max laser drilling size||0.15mm|
|Blind Via Finished Hole Size||0.3mm|
|Buried Via Finished Hole Size||0.3mm|
|Non Conductive Filled Vias||0.2mm~0.8mm|
|Conductive Filled Vias||0.2~0.8mm|
|ENIG (Electroless Nickel/Immersion Gold)||AU： 0.05~0.1um Nickel: 3~5um|
|Lead Free HASL||2~40um|
|Flash gold(electroplated gold)||Au 0.025-0.10um，Nickel 3~5um|
|electroplated Gold finger||Au 0.25-1.0um Nickel 3~5um|
|Selective Gold||Au 0.25-1.0um Nickel 3~5um|
|Soldermask||min. 8um, max. 30um|
|Min mechanical hole 4mil/6mil/8mi||0.8mm/1.5mm/2.5mm|
|Finshed mechanical hole size||0.1~6.0mm|
|MAX aspect ratio for Hole||12:01:00|
|Max aspect ratio for mechanical depth- control||1.3:1|
|Min. depth of Mechanical depth- control(backdrill)||0.2mm|
|Min gap between hole wall conductor||7mil|
|Min space between laser holes and conductor||5mil|
|Min space bwteen hole walls in different net||12mil|
|Min space bwteen hole walls in same net||8mil|
|Min space bwteen NPTH hole walls||10mil|
|Hole location tolerance||'+/-3mil|
|Pressfit holes tolerance||'+/-0.05mm|
|Countersink depth tolerance||'+/-0.15mm|
|Countersink hole size tolerance||'+/-0.15mm|
|Min Pad size for laser drillings||0.25mm|
|Min Pad size for mechanical drilling||0.4mm|
|Min Pad size for mechanical drilling||0.3mm|
|Min BGA pad size||0.4mm|
|Pad size tolerance(BGA)||'+/-2mil|
|Min lead pitch||0.3mm|
|Min BGA ball pitch||0.3mm|
|Internal Layer||1/3OZ: N/A|
|Internal Layer||1/2OZ: 3.5/3.5mil|
|Internal Layer||1OZ: 3/4mil|
|Internal Layer||2OZ: 4/5mil|
|External Layer||1/3OZ: 3/3mil|
|Min copper pour to Pour||7mil|
|Min copper pour to trace||4mil|
|Min copper pour to microvia||8mil|
|Min copper pour to buired via||4mil|
|Min copper pour to SMD Pad||5mil|
|Min copper pour to PTH Pad||5mil|
|Soldermask color||Semi Gloss greeen\Gloss Green\Matte Green\Black\Red\Blue\Yellow|
|Solder Mask Min Dam Size||4mil|
|Solder Mask Min Dam Size in BGA Area||4mil|
|Solder Mask Registration||'+/-4mil|
|Silkscreen color||White, yellow , black|
|Min width of soldermask bridge||White, yellow , black|
|Min width of soldermask bridge||4mil|
|Min. Diameter Rout Cutter Available||0.6mm|
|Routed Part Size Tolerance||'+/-0.15mm|
|V-CUT symmetrical tolerance||'+/-0.1mm|
|MAX V-CUT lines||80 lines|
|V-CUT angle tolerance||'+/-5 degress|
|V Score, Edge to Copper||H≤1.0mm:0.3mm(20°)、0.33mm(30°)、0.37mm(45°);|
|V Score, Edge to Copper||1.0<H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°);|
|V Score, Edge to Copper||1.6<H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°);|
|V-CUT angle||20、30、45 degree|
|Gold finger bevelling||20、30、45、60 degree|
|Gold finger bevelling tolerance||'+/-5 degree|
|Min space of gold finger chamfering||6mm|
|Min gap between the side of||8mil|
|Layer count||1~28 layer|
|PCB thickness tolerance˄Normal||Thickness : ±10%(＞1.0mm)；±0.1mm(≤1.0mm)；|
|PCB thickness tolerance˄Special ˅||Thickness ±0.1mm（≤2.0mm）；±0.15mm（2.1-3.0mm）|
|Controlled Impedance Tolerance||'+/-10%|
|Testing methods||Flying probe testing, Test fixture|
|Quality standards||IPC II, IPC III|
Organic substrates (made from organic materials such as fiberglass), inorganic substrates (made from inorganic materials such as silicon or ceramics), and flexible substrates are all available (made from flexible materials such as polyimide). The substrate material selected is determined by the application’s specific requirements, such as the density and complexity of the ICs, the operating environment, and the required performance and reliability.
IC substrates are typically produced by specialized PCB manufacturers with the capability and expertise to produce high-density, high-performance PCBs. Consider the manufacturer’s reputation and track record in the industry, the range of substrate materials and technologies they offer, and their design and engineering support services when choosing an IC substrate manufacturer. You should also consider the substrates’ cost and lead time, as well as the manufacturer’s quality control and testing processes.
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Frequently asked questions
What are IC substrates?
What are IC substrates used for?
What are the different types of IC substrate materials?
How do I select an IC substrate manufacturer?
Can IC substrates be repaired or modified?
What are the advantages of using IC substrates?
Why Choose Us?
Since 2018, WINOW has been providing high-quality PCBs with quick turnaround times and high customer satisfaction. We are one of the largest and most skilled board manufacturers in China.
Orders for prototypes are processed within 24 hours.
Small batch production and some PCB prototypes have a 48-hour lead time.
PCB prototypes and small-batch manufacturing typically take 5-7 working days.
Flexible payment options
There is no minimum purchase or order amount. Orders for prototypes and mass production are both accepted.
Inspection Of Quality
90% of the technical staff has more than ten years of experience in the industry.
PCB Assembly can be adjusted at any time to meet customer ICT, veneer, aging, and ATE requirements.