crossorigin="anonymous"> Multilayer PCB Manufacture - Winow
Multilayer PCB

Multilayer PCB Manufacturer

A multilayer printed circuit board has more than two layers of conductive material. These layers, which are usually made of copper, are separated by insulating layers known as core layers.

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Multilayer PCB Manufacturing Solutions

A circuit board with more than two layers is known as a multilayer PCB. In contrast to a double-sided PCB, which has only two conductive layers of material, all multilayer PCBs must have at least three conductive layers buried in the center of the material. A multilayer printed circuit board has more than two layers of conductive material. These layers, which are usually made of copper, are separated by insulating layers known as core layers. The main benefit of a multilayer PCB is that it allows for a more complex and densely packed circuit design because the extra layers provide more space for routing traces and placing components. This is particularly useful in high-density applications like smartphones, laptops, and other portable devices.

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We can provide to...

  • Turn times as short as 24 hours
  • 1 to 100,000 units
  • Class II Inspection standard and Class III Inspection available
  • 100% on-time guarantee
  • DFM support
  • Lead free (RoHS) options
  • SMT and thru-hole capabilities
  • All SMT machine placed
  • AOI (Automated Optical Inspection)
  • Lead-free RoHS Certification and ITAR compliance screen available
  • Program Design
  • flex Board Capability
  • PCB manufacturing Capabilities
  • Equipment Exhibition

From component purchasing to functional testing and package completion, we provide one-stop services for all types of PCBs.

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Quick payment

Flexible payment options

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On-Demand Manufacturing

No MOQ or MPQ limited. Prototype or mass production order acceptable.

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Inspection Of Quality

90% of the technical staff have more than 10 years of industry experience

flex Board Capability

Layer Count 1-6L 1-4 L normal
Board Thickness 0.1-0.5mm (1-4L) 0.6-0.8mm (5-6L)
The tolerance of 1L board thickness ±0.03mm
The tolerance of 2L board thickness ±0.03mm
The tolerance of multilayer board thickness ±10% (Normal ±0.1mm)
The tolerance of multilayer board thickness ±10% (Normal ±0.05mm)
The tolerance of board thickness ±10% (Normal ±0.1mm)
The tolerance of board thickness 9inch*23inch(PI≥1mil) 9inch*14inch (normal)
Max finished board size 2mm*4mm(no connection tab);8mm*8mm(with connection tab)
Min finished board size 生益 SF305: PI=0.5mil, 1mil, 2mil; Cu=0.33OZ, 0.5OZ, 1OZ
Adhesive flex core 杜邦AP:PI=1mil,2mil,3mil,4mil;Cu=0.5oz,1oz, 2oz
Adhesiveless core 杜邦AP:PI=1mil,2mil,3mil,4mil;Cu=0.5oz,1oz, 2oz
Thermosetting adhesive 杜邦LF:0110,0210
PI stiffener 台虹 MHK 系列: PI=3mil, 5mil , 7mil, 9mil
3M tape 9077,9460
Finished copper thickness 12um / 18um 3/3mil
Finished copper thickness 35um 4/3.5mil
Finished copper thickness 70um 6/5mil
Solder mask bridge min. (copper thickness<=1oz) 4mil(Green),5mil(White),8.0mil(big copper area)
Solder mask opening (single side) 6mil,8mil(big copper area)
Solder mask opening of NPTH (single side) 3mil(partial2.5mil)
Min. coverlay bridge 8mil
Finished copper thickness 12um / 18um 5/5mil (after compensation)
Finished copper thickness 35um 6.5/5mil (after compensation)
Finished copper thickness 70um 10/8mil (after compensation)
Min. Inner layer annual ring width 4mil(<4L),7mil(4-6L),9mil(7-8L)
The min distance between inner layer isolated pad and copper area 3.5mil 4mil normal
Max finished inner layer copper thickness 3oz 2 oz normal
Finished copper thickness, before compensation 3/3mil
Finished copper thickness 35um, before compensation 3.5/3.5mil
Finished copper thickness 70um, before compensation 5.5/5mil
Finished copper thickness 35um, 3mil(<2mm);4mil(2-4.5mm)
Finished copper thickness 35-70um, 5mil(<2mm);6mil(2-4.5mm)
Finished copper thickness >70um, 7mil(<2mm);10mil(2-4.5mm)
Min the distance between NPTH edge to external conductor before compensation 4oz 2 oz normal
Max finished external copper thickness 8mil 5mil(Gold finger area)
The max board thickness for 0.15mm drill bit 0.8mm
Min laser hole diameter 0.1mm
Min finish half PTH via diameter 0.3mm
Min NPTH tolerance ±2mil(limit+0,-2mil or +2mil,-0)
Min space between via hole walls in different net, before compensation 10mil(after compensation) 12mil (normal)(after compensation)
Tolerance of stiffener tape ±0.1mm (Normal ±0.2mm)
Tolerance of Coverlay ±2mil ((Normal ±4mil)
Min distance between coverlay opening and conduct 3mil ((Normal 4mil)

PCB manufacturing Capabilities

Normal Tg FR4(Halogen free) Shengyi S1150
High Tg FR4(Halogen free) Shengyi S1165
HDI PCB material LDPP(IT-180A 1037,1086)、Normal 106,1080
High Tg FR4 Isola:FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR
Ceramic Particle Filled Laminates Rogers:Rogers4350、Rogers4003;Arlon:25FR、25N;
PTFE Laminates Rogers、Taconic、Arlon、Nelco、TP
PTFE PP Taconic:TP、TPN、HT1.5(1.5mil)、Fastrise
Rigid PCB Back board、HDI、
Blind&buried via type Laminating≤3 times
HDI PCB 1+n+1、1+1+n+1+1、2+n+2、3+n+3
Lead free Flash gold、ENIG
aspect ratio 10:01:00
Max finished size HAL Leaded 22"*39"
MIN finished size HAL Leaded 5"*6"
PCB thickness HAL Leaded0.6-4.0mm;
MAX high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mi
Max lamination cycle 3 times
Min laser drill for stacked via 0.1mm
Min stacked via pad size 0.3mm
Max laser drilling size 0.15mm
Blind Via Finished Hole Size 0.3mm
Buried Via Finished Hole Size 0.3mm
Non Conductive Filled Vias 0.2mm~0.8mm
Conductive Filled Vias 0.2~0.8mm
ENIG (Electroless Nickel/Immersion Gold) AU: 0.05~0.1um Nickel: 3~5um
Hard gold 0.1~1.0um
Soft gold 0.1~1.0um
Lead Free HASL 2~40um
Flash gold(electroplated gold) Au 0.025-0.10um,Nickel 3~5um
electroplated Gold finger Au 0.25-1.0um Nickel 3~5um
Selective Gold Au 0.25-1.0um Nickel 3~5um
Tin Nickel N/A
Immersion Silver 0.2~0.4um
Soldermask min. 8um, max. 30um
Min mechanical hole 4mil/6mil/8mi 0.8mm/1.5mm/2.5mm
Finshed mechanical hole size 0.1~6.0mm
MAX aspect ratio for Hole 12:01:00
Max aspect ratio for mechanical depth- control 1.3:1
Min. depth of Mechanical depth- control(backdrill) 0.2mm
Min gap between hole wall conductor 7mil
Min space between laser holes and conductor 5mil
Min space bwteen hole walls in different net 12mil
Min space bwteen hole walls in same net 8mil
Min space bwteen NPTH hole walls 10mil
Hole location tolerance '+/-3mil
NPTH tolerance '+/-0.05mm
Pressfit holes tolerance '+/-0.05mm
Countersink depth tolerance '+/-0.15mm
Countersink hole size tolerance '+/-0.15mm
Min Pad size for laser drillings 0.25mm
Min Pad size for mechanical drilling 0.4mm
Min Pad size for mechanical drilling 0.3mm
Min BGA pad size 0.4mm
Pad size tolerance(BGA) '+/-2mil
Min lead pitch 0.3mm
Min BGA ball pitch 0.3mm
Internal Layer 1/3OZ: N/A
Internal Layer 1/2OZ: 3.5/3.5mil
Internal Layer 1OZ: 3/4mil
Internal Layer 2OZ: 4/5mil
External Layer 1/3OZ: 3/3mil
External Layer 1/2OZ:3.5/3.5mil
Width tolerance ≤10mil:+/-20%
Min copper pour to Pour 7mil
Min copper pour to trace 4mil
Min copper pour to microvia 8mil
Min copper pour to buired via 4mil
Min copper pour to SMD Pad 5mil
Min copper pour to PTH Pad 5mil
Soldermask color Semi Gloss greeen\Gloss Green\Matte Green\Black\Red\Blue\Yellow
Solder Mask Min Dam Size 4mil
Solder Mask Min Dam Size in BGA Area 4mil
Solder Mask Registration '+/-4mil
Silkscreen color White, yellow , black
Min width of soldermask bridge White, yellow , black
Min width of soldermask bridge 4mil
Min. Diameter Rout Cutter Available 0.6mm
Routed Part Size Tolerance '+/-0.15mm
V-CUT symmetrical tolerance '+/-0.1mm
MAX V-CUT lines 80 lines
V-CUT angle tolerance '+/-5 degress
V Score, Edge to Copper H≤1.0mm:0.3mm(20°)、0.33mm(30°)、0.37mm(45°);
V Score, Edge to Copper 1.0<H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°);
V Score, Edge to Copper 1.6<H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°);
V-CUT angle 20、30、45 degree
Gold finger bevelling 20、30、45、60 degree
Gold finger bevelling tolerance '+/-5 degree
Min space of gold finger chamfering 6mm
Min gap between the side of 8mil
Layer count 1~28 layer
PCB thickness 0.4~6..0mm
PCB thickness tolerance˄Normal Thickness : ±10%(>1.0mm);±0.1mm(≤1.0mm);
PCB thickness tolerance˄Special ˅ Thickness ±0.1mm(≤2.0mm);±0.15mm(2.1-3.0mm)
Min bow&twist 0.75%
Controlled Impedance Tolerance '+/-10%
Testing methods Flying probe testing, Test fixture
Quality standards IPC II, IPC III

Testing Procedures

Multilayer PCBs are typically manufactured like single-layer PCBs, but with additional steps to create and bond the additional layers. Photolithography, etching, and plating processes are typically used to create the circuit patterns on each layer, followed by a lamination process to bond the layers together.

A multilayer PCB can have any number of layers, but common configurations include four-layer, six-layer, and eight-layer boards. The cost and complexity of a multilayer PCB increase with the number of layers, so when designing a multilayer PCB, it is critical to carefully consider the trade-offs.

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Frequently asked questions

What is a multilayer PCB?

Why use a multilayer PCB?

How many layers can a multilayer PCB have?

How is a multilayer PCB made?

Are multilayer PCBs more expensive than single-layer PCBs?

Michaela ★★★★★

The received assembled PCB's worked flawlessly. The placement of the parts is excellent. I had a very good contact with Mis wang the WINOW engineer who took care of our project. She asked the right questions to make sure the project was finished correctly. We had a very pleasant communication, fast and to the point.

Herbert ★★★★★

This board is needed to charge the lipo batteries of my robotic platform (rover). First time order with excellent communications throughout the ordering, manufacturing progress and up to delivery tracking. Very good price especially the first order with a discount credit.

Al Lemke ★★★★★

Boards arrived yesterday and got started on assembly.  Excellent, solder wetting, clean line
 definition, via drill holes exactly in the middle of via lands. 
  Please pass my thanks back to one and  all who made such excellent  boards.

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Rated 9.0 Out Of 10 Based On 100,000+Reviews, Please feel free to inquire

Why Choose Us?

WINOW has been providing high-quality PCBs with quick turnaround times and high customer satisfaction since 2018. We are one of China's largest and most skilled board manufacturers

  • icon_hock Prototype orders are processed within 24 hours.
  • icon_hock The lead time for small batch production and some PCB prototypes is 48 hours.
  • icon_hock Typically, PCB prototypes and small-batch manufacturing take 5-7 working days.
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Quick payment

Flexible payment options

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On-Demand Manufacturing

There is no minimum purchase or order amount. Orders for prototypes and mass production are both accepted.

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Inspection Of Quality

90% of the technical staff has more than ten years of experience in the industry.

Technical Strength

PCB Assembly can be adjusted at any time to meet customer ICT, veneer, aging, and ATE requirements.

Quick Delivery and Comprehensive Support