HDI PCB Manufacturer

HDI PCB Manufacturer

HDI PCB is an acronym that stands for High-Density Interconnect Printed Circuit Board. It is a type of printed circuit board (PCB) that has a higher component density than standard PCBs, allowing for smaller and more complex electronic devices. HDI PCBs are created using cutting-edge techniques such as laser drilling and micro vias, which enable smaller interconnections and higher circuit densities.

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HDI PCB Manufacturing Solutions

In the world of PCB design, HDI PCB Technology refers to High-Density Interconnect PCB. A printed circuit board with a higher wiring density per unit area than a standard board is known as a High Density Interconnect PCB. In comparison to traditional PCBs, HDI PCBs have several advantages, including the ability to create smaller and more complex electronic devices. HDI PCBs are made with cutting-edge techniques like laser drilling and microvias, which allow for smaller interconnections and higher circuit densities.

We can provide to...

  • Turn times as short as 24 hours
  • 1 to 100,000 units
  • Class II Inspection standard and Class III Inspection available
  • 100% on-time guarantee
  • DFM support
  • Lead free (RoHS) options
  • SMT and thru-hole capabilities
  • All SMT machine placed
  • AOI (Automated Optical Inspection)
  • Lead-free RoHS Certification and ITAR compliance screen available
  • Program Design
  • flex Board Capability
  • PCB manufacturing Capabilities
  • Equipment Exhibition

We offer one-stop services for all types of PCBs, from component purchasing to functional testing and package completion.

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Quick payment

Flexible payment options

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On-Demand Manufacturing

No MOQ or MPQ limited. Prototype or mass production order acceptable.

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Inspection Of Quality

90% of the technical staff have more than 10 years of industry experience

flex Board Capability

Layer Count 1-6L 1-4 L normal
Board Thickness 0.1-0.5mm (1-4L) 0.6-0.8mm (5-6L)
The tolerance of 1L board thickness ±0.03mm
The tolerance of 2L board thickness ±0.03mm
The tolerance of multilayer board thickness ±10% (Normal ±0.1mm)
The tolerance of multilayer board thickness ±10% (Normal ±0.05mm)
The tolerance of board thickness ±10% (Normal ±0.1mm)
The tolerance of board thickness 9inch*23inch(PI≥1mil) 9inch*14inch (normal)
Max finished board size 2mm*4mm(no connection tab);8mm*8mm(with connection tab)
Min finished board size 生益 SF305: PI=0.5mil, 1mil, 2mil; Cu=0.33OZ, 0.5OZ, 1OZ
Adhesive flex core 杜邦AP:PI=1mil,2mil,3mil,4mil;Cu=0.5oz,1oz, 2oz
Adhesiveless core 杜邦AP:PI=1mil,2mil,3mil,4mil;Cu=0.5oz,1oz, 2oz
Thermosetting adhesive 杜邦LF:0110,0210
PI stiffener 台虹 MHK 系列: PI=3mil, 5mil , 7mil, 9mil
3M tape 9077,9460
Finished copper thickness 12um / 18um 3/3mil
Finished copper thickness 35um 4/3.5mil
Finished copper thickness 70um 6/5mil
Solder mask bridge min. (copper thickness<=1oz) 4mil(Green),5mil(White),8.0mil(big copper area)
Solder mask opening (single side) 6mil,8mil(big copper area)
Solder mask opening of NPTH (single side) 3mil(partial2.5mil)
Min. coverlay bridge 8mil
Finished copper thickness 12um / 18um 5/5mil (after compensation)
Finished copper thickness 35um 6.5/5mil (after compensation)
Finished copper thickness 70um 10/8mil (after compensation)
Min. Inner layer annual ring width 4mil(<4L),7mil(4-6L),9mil(7-8L)
The min distance between inner layer isolated pad and copper area 3.5mil 4mil normal
Max finished inner layer copper thickness 3oz 2 oz normal
Finished copper thickness, before compensation 3/3mil
Finished copper thickness 35um, before compensation 3.5/3.5mil
Finished copper thickness 70um, before compensation 5.5/5mil
Finished copper thickness 35um, 3mil(<2mm);4mil(2-4.5mm)
Finished copper thickness 35-70um, 5mil(<2mm);6mil(2-4.5mm)
Finished copper thickness >70um, 7mil(<2mm);10mil(2-4.5mm)
Min the distance between NPTH edge to external conductor before compensation 4oz 2 oz normal
Max finished external copper thickness 8mil 5mil(Gold finger area)
The max board thickness for 0.15mm drill bit 0.8mm
Min laser hole diameter 0.1mm
Min finish half PTH via diameter 0.3mm
Min NPTH tolerance ±2mil(limit+0,-2mil or +2mil,-0)
Min space between via hole walls in different net, before compensation 10mil(after compensation) 12mil (normal)(after compensation)
Tolerance of stiffener tape ±0.1mm (Normal ±0.2mm)
Tolerance of Coverlay ±2mil ((Normal ±4mil)
Min distance between coverlay opening and conduct 3mil ((Normal 4mil)

PCB manufacturing Capabilities

Normal Tg FR4(Halogen free) Shengyi S1150
High Tg FR4(Halogen free) Shengyi S1165
HDI PCB material LDPP(IT-180A 1037,1086)、Normal 106,1080
High Tg FR4 Isola:FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR
Ceramic Particle Filled Laminates Rogers:Rogers4350、Rogers4003;Arlon:25FR、25N;
PTFE Laminates Rogers、Taconic、Arlon、Nelco、TP
PTFE PP Taconic:TP、TPN、HT1.5(1.5mil)、Fastrise
Rigid PCB Back board、HDI、
Blind&buried via type Laminating≤3 times
HDI PCB 1+n+1、1+1+n+1+1、2+n+2、3+n+3
Lead free Flash gold、ENIG
aspect ratio 10:01:00
Max finished size HAL Leaded 22"*39"
MIN finished size HAL Leaded 5"*6"
PCB thickness HAL Leaded0.6-4.0mm;
MAX high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mi
Max lamination cycle 3 times
Min laser drill for stacked via 0.1mm
Min stacked via pad size 0.3mm
Max laser drilling size 0.15mm
Blind Via Finished Hole Size 0.3mm
Buried Via Finished Hole Size 0.3mm
Non Conductive Filled Vias 0.2mm~0.8mm
Conductive Filled Vias 0.2~0.8mm
ENIG (Electroless Nickel/Immersion Gold) AU: 0.05~0.1um Nickel: 3~5um
Hard gold 0.1~1.0um
Soft gold 0.1~1.0um
Lead Free HASL 2~40um
Flash gold(electroplated gold) Au 0.025-0.10um,Nickel 3~5um
electroplated Gold finger Au 0.25-1.0um Nickel 3~5um
Selective Gold Au 0.25-1.0um Nickel 3~5um
Tin Nickel N/A
Immersion Silver 0.2~0.4um
Soldermask min. 8um, max. 30um
Min mechanical hole 4mil/6mil/8mi 0.8mm/1.5mm/2.5mm
Finshed mechanical hole size 0.1~6.0mm
MAX aspect ratio for Hole 12:01:00
Max aspect ratio for mechanical depth- control 1.3:1
Min. depth of Mechanical depth- control(backdrill) 0.2mm
Min gap between hole wall conductor 7mil
Min space between laser holes and conductor 5mil
Min space bwteen hole walls in different net 12mil
Min space bwteen hole walls in same net 8mil
Min space bwteen NPTH hole walls 10mil
Hole location tolerance '+/-3mil
NPTH tolerance '+/-0.05mm
Pressfit holes tolerance '+/-0.05mm
Countersink depth tolerance '+/-0.15mm
Countersink hole size tolerance '+/-0.15mm
Min Pad size for laser drillings 0.25mm
Min Pad size for mechanical drilling 0.4mm
Min Pad size for mechanical drilling 0.3mm
Min BGA pad size 0.4mm
Pad size tolerance(BGA) '+/-2mil
Min lead pitch 0.3mm
Min BGA ball pitch 0.3mm
Internal Layer 1/3OZ: N/A
Internal Layer 1/2OZ: 3.5/3.5mil
Internal Layer 1OZ: 3/4mil
Internal Layer 2OZ: 4/5mil
External Layer 1/3OZ: 3/3mil
External Layer 1/2OZ:3.5/3.5mil
Width tolerance ≤10mil:+/-20%
Min copper pour to Pour 7mil
Min copper pour to trace 4mil
Min copper pour to microvia 8mil
Min copper pour to buired via 4mil
Min copper pour to SMD Pad 5mil
Min copper pour to PTH Pad 5mil
Soldermask color Semi Gloss greeen\Gloss Green\Matte Green\Black\Red\Blue\Yellow
Solder Mask Min Dam Size 4mil
Solder Mask Min Dam Size in BGA Area 4mil
Solder Mask Registration '+/-4mil
Silkscreen color White, yellow , black
Min width of soldermask bridge White, yellow , black
Min width of soldermask bridge 4mil
Min. Diameter Rout Cutter Available 0.6mm
Routed Part Size Tolerance '+/-0.15mm
V-CUT symmetrical tolerance '+/-0.1mm
MAX V-CUT lines 80 lines
V-CUT angle tolerance '+/-5 degress
V Score, Edge to Copper H≤1.0mm:0.3mm(20°)、0.33mm(30°)、0.37mm(45°);
V Score, Edge to Copper 1.0<H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°);
V Score, Edge to Copper 1.6<H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°);
V-CUT angle 20、30、45 degree
Gold finger bevelling 20、30、45、60 degree
Gold finger bevelling tolerance '+/-5 degree
Min space of gold finger chamfering 6mm
Min gap between the side of 8mil
Layer count 1~28 layer
PCB thickness 0.4~6..0mm
PCB thickness tolerance˄Normal Thickness : ±10%(>1.0mm);±0.1mm(≤1.0mm);
PCB thickness tolerance˄Special ˅ Thickness ±0.1mm(≤2.0mm);±0.15mm(2.1-3.0mm)
Min bow&twist 0.75%
Controlled Impedance Tolerance '+/-10%
Testing methods Flying probe testing, Test fixture
Quality standards IPC II, IPC III

Testing Procedures

Smartphones, tablets, laptop computers, and other portable electronic devices all use HDI-printed circuit boards. They’re also used in high-speed communication systems, military and aerospace systems, and medical devices.

  1. HDI PCBs can be made smaller than traditional PCBs due to their higher component density, making them ideal for use in compact electronic devices.
  2. Higher performance: HDI PCBs have lower resistance and capacitance than traditional PCBs, which can result in improved performance and reliability.
  3. HDI PCBs can be made of flexible or rigid-flex materials, allowing for greater design flexibility and the ability to fit into small spaces. Higher reliability: Because of their advanced manufacturing processes and materials, HDI PCBs are less prone to failure, which can result in a longer lifespan and lower maintenance costs.
  4. Options for customization: HDI PCBs can be tailored to meet the specific requirements of various applications, including the use of specialized materials and high-density features such as blind and buried vias.
  5. Cost-effectiveness: While HDI PCBs are initially more expensive, their improved performance and reliability can make them more cost-effective in the long run, especially in applications where traditional PCBs would fail to meet the required specifications.

Bring you better PCB products

Circuit Board Fabrication and PCB Assembly Turnkey Services

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Frequently asked questions

What does HDI PCB stand for?

How are HDI PCBs made?

What are the advantages of HDI PCBs?

What are HDI PCBs used for?

Can HDI PCBs be repaired or modified?

How do I select an HDI PCB manufacturer?

Michaela ★★★★★

The assembled PCBs that were delivered worked flawlessly. The component placement is excellent. Mis wang, the WINOW engineer in charge of our project, and I hit it off right away. She asked pertinent questions to ensure that the project was properly completed. We had a very nice, short, and to-the-point conversation.

Herbert ★★★★★

This board is required to charge my robotic platform's lipo batteries (rover). Excellent communication throughout the ordering process, manufacturing progress, and delivery tracking for a first-time order. Very reasonable price, especially for the first order with a credit for a discount.

Al Lemke ★★★★★

The boards arrived yesterday, and assembly has begun. Excellent solder wetting, crisp line definition, and drill holes precisely in the center of via lands.
Please convey my appreciation to everyone who created such fantastic boards.

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Rated 9.0 Out Of 10 Based On 100,000+Reviews, Please feel free to inquire

Why Choose Us?

Since 2018, WINOW has been providing high-quality PCBs with quick turnaround times and high customer satisfaction. We are one of the largest and most skilled board manufacturers in China.

  • icon_hock PCB prototypes and small-batch manufacturing typically take 5-7 working days.
  • icon_hock Orders for prototypes are processed within 24 hours
  • icon_hock Small batch production and some PCB prototypes have a 48-hour lead time.
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Quick payment

Flexible payment options

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On-Demand Manufacturing

There is no minimum order or purchase amount. Both prototype and mass production orders are accepted.

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Inspection Of Quality

90% of the technical staff has worked in the industry for more than ten years.

Technical Strength

PCB Assembly can be changed at any time to meet the customer's requirements for ICT, veneer, aging, and ATE

Quick Delivery and Comprehensive Support