PCB Prototype Manufacturer
- 10+ Year Experience on PCB Prototype Services
Maximum Panel size: 19.7" x 31.5"
Maximum Number of Layers: 1-40
Copper Thickness: 0.5 oz to 5.0 oz
Minimum Line Width: 3 mil
Minimum Line spacing: 3 mil.
Smallest Hole: 0.006
Blind, Buried and plugged Vias
PCB Prototype Manufacturing Solutions
PCB prototypes are the first samples of a product that are built to test the functionality of the design ideas. Designers and engineers test various aspects of a chosen design using various types of PCB prototypes. The primary goal of creating a PCB prototype is to ensure that the circuit works as intended and to identify and resolve any issues before mass-producing the final PCB design.
We can provide to...
- Turn times as short as 24 hours
- 1 to 100,000 units
- Class II Inspection standard and Class III Inspection available
- 100% on-time guarantee
- DFM support
- Lead free (RoHS) options
- SMT and thru-hole capabilities
- All SMT machine placed
- AOI (Automated Optical Inspection)
- Lead-free RoHS Certification and ITAR compliance screen available
flex Board Capability
PCB manufacturing Capabilities
From component purchasing to function testing and package completion, we provide one-stop service for all types of PCBs.
Flexible payment options
No MOQ or MPQ limited. Prototype or mass production order acceptable.
Inspection Of Quality
90% of the technical staff have more than 10 years of industry experience
flex Board Capability
|Layer Count||1-6L 1-4 L normal|
|Board Thickness||0.1-0.5mm (1-4L) 0.6-0.8mm (5-6L)|
|The tolerance of 1L board thickness||±0.03mm|
|The tolerance of 2L board thickness||±0.03mm|
|The tolerance of multilayer board thickness||±10% (Normal ±0.1mm）|
|The tolerance of multilayer board thickness||±10% (Normal ±0.05mm）|
|The tolerance of board thickness||±10% (Normal ±0.1mm）|
|The tolerance of board thickness||9inch*23inch（PI≥1mil） 9inch*14inch (normal)|
|Max finished board size||2mm*4mm（no connection tab）；8mm*8mm（with connection tab）|
|Min finished board size||生益 SF305： PI=0.5mil， 1mil， 2mil； Cu=0.33OZ， 0.5OZ， 1OZ|
|Adhesive flex core||杜邦AP：PI=1mil，2mil，3mil,4mil；Cu=0.5oz，1oz, 2oz|
|Adhesiveless core||杜邦AP：PI=1mil，2mil，3mil,4mil；Cu=0.5oz，1oz, 2oz|
|PI stiffener||台虹 MHK 系列： PI=3mil， 5mil ， 7mil， 9mil|
|Finished copper thickness 12um / 18um||3/3mil|
|Finished copper thickness 35um||4/3.5mil|
|Finished copper thickness 70um||6/5mil|
|Solder mask bridge min. (copper thickness<=1oz)||4mil(Green)，5mil(White)，8.0mil（big copper area）|
|Solder mask opening (single side)||6mil，8mil（big copper area）|
|Solder mask opening of NPTH (single side)||3mil(partial2.5mil)|
|Min. coverlay bridge||8mil|
|Finished copper thickness 12um / 18um||5/5mil (after compensation)|
|Finished copper thickness 35um||6.5/5mil (after compensation)|
|Finished copper thickness 70um||10/8mil (after compensation)|
|Min. Inner layer annual ring width||4mil（＜4L），7mil（4-6L），9mil（7-8L）|
|The min distance between inner layer isolated pad and copper area||3.5mil 4mil normal|
|Max finished inner layer copper thickness||3oz 2 oz normal|
|Finished copper thickness, before compensation||3/3mil|
|Finished copper thickness 35um, before compensation||3.5/3.5mil|
|Finished copper thickness 70um, before compensation||5.5/5mil|
|Finished copper thickness 35um,||3mil（＜2mm）；4mil（2-4.5mm）|
|Finished copper thickness 35-70um,||5mil（＜2mm）；6mil（2-4.5mm）|
|Finished copper thickness >70um,||7mil（＜2mm）；10mil（2-4.5mm）|
|Min the distance between NPTH edge to external conductor before compensation||4oz 2 oz normal|
|Max finished external copper thickness||8mil 5mil（Gold finger area）|
|The max board thickness for 0.15mm drill bit||0.8mm|
|Min laser hole diameter||0.1mm|
|Min finish half PTH via diameter||0.3mm|
|Min NPTH tolerance||±2mil(limit+0，-2mil or +2mil，-0)|
|Min space between via hole walls in different net, before compensation||10mil(after compensation) 12mil (normal)(after compensation)|
|Tolerance of stiffener tape||±0.1mm (Normal ±0.2mm)|
|Tolerance of Coverlay||±2mil ((Normal ±4mil)|
|Min distance between coverlay opening and conduct||3mil ((Normal 4mil)|
PCB manufacturing Capabilities
|Normal Tg FR4(Halogen free)||Shengyi S1150|
|High Tg FR4(Halogen free)||Shengyi S1165|
|HDI PCB material||LDPP（IT-180A 1037,1086）、Normal 106,1080|
|High Tg FR4||Isola：FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR|
|Ceramic Particle Filled Laminates||Rogers：Rogers4350、Rogers4003;Arlon:25FR、25N;|
|Rigid PCB||Back board、HDI、|
|Blind&buried via type||Laminating≤3 times|
|Lead free||Flash gold、ENIG|
|Max finished size||HAL Leaded 22"*39"|
|MIN finished size||HAL Leaded 5"*6"|
|PCB thickness||HAL Leaded0.6-4.0mm；|
|MAX high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mi|
|Max lamination cycle||3 times|
|Min laser drill for stacked via||0.1mm|
|Min stacked via pad size||0.3mm|
|Max laser drilling size||0.15mm|
|Blind Via Finished Hole Size||0.3mm|
|Buried Via Finished Hole Size||0.3mm|
|Non Conductive Filled Vias||0.2mm~0.8mm|
|Conductive Filled Vias||0.2~0.8mm|
|ENIG (Electroless Nickel/Immersion Gold)||AU： 0.05~0.1um Nickel: 3~5um|
|Lead Free HASL||2~40um|
|Flash gold(electroplated gold)||Au 0.025-0.10um，Nickel 3~5um|
|electroplated Gold finger||Au 0.25-1.0um Nickel 3~5um|
|Selective Gold||Au 0.25-1.0um Nickel 3~5um|
|Soldermask||min. 8um, max. 30um|
|Min mechanical hole 4mil/6mil/8mi||0.8mm/1.5mm/2.5mm|
|Finshed mechanical hole size||0.1~6.0mm|
|MAX aspect ratio for Hole||12:01:00|
|Max aspect ratio for mechanical depth- control||1.3:1|
|Min. depth of Mechanical depth- control(backdrill)||0.2mm|
|Min gap between hole wall conductor||7mil|
|Min space between laser holes and conductor||5mil|
|Min space bwteen hole walls in different net||12mil|
|Min space bwteen hole walls in same net||8mil|
|Min space bwteen NPTH hole walls||10mil|
|Hole location tolerance||'+/-3mil|
|Pressfit holes tolerance||'+/-0.05mm|
|Countersink depth tolerance||'+/-0.15mm|
|Countersink hole size tolerance||'+/-0.15mm|
|Min Pad size for laser drillings||0.25mm|
|Min Pad size for mechanical drilling||0.4mm|
|Min Pad size for mechanical drilling||0.3mm|
|Min BGA pad size||0.4mm|
|Pad size tolerance(BGA)||'+/-2mil|
|Min lead pitch||0.3mm|
|Min BGA ball pitch||0.3mm|
|Internal Layer||1/3OZ: N/A|
|Internal Layer||1/2OZ: 3.5/3.5mil|
|Internal Layer||1OZ: 3/4mil|
|Internal Layer||2OZ: 4/5mil|
|External Layer||1/3OZ: 3/3mil|
|Min copper pour to Pour||7mil|
|Min copper pour to trace||4mil|
|Min copper pour to microvia||8mil|
|Min copper pour to buired via||4mil|
|Min copper pour to SMD Pad||5mil|
|Min copper pour to PTH Pad||5mil|
|Soldermask color||Semi Gloss greeen\Gloss Green\Matte Green\Black\Red\Blue\Yellow|
|Solder Mask Min Dam Size||4mil|
|Solder Mask Min Dam Size in BGA Area||4mil|
|Solder Mask Registration||'+/-4mil|
|Silkscreen color||White, yellow , black|
|Min width of soldermask bridge||White, yellow , black|
|Min width of soldermask bridge||4mil|
|Min. Diameter Rout Cutter Available||0.6mm|
|Routed Part Size Tolerance||'+/-0.15mm|
|V-CUT symmetrical tolerance||'+/-0.1mm|
|MAX V-CUT lines||80 lines|
|V-CUT angle tolerance||'+/-5 degress|
|V Score, Edge to Copper||H≤1.0mm:0.3mm(20°)、0.33mm(30°)、0.37mm(45°);|
|V Score, Edge to Copper||1.0<H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°);|
|V Score, Edge to Copper||1.6<H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°);|
|V-CUT angle||20、30、45 degree|
|Gold finger bevelling||20、30、45、60 degree|
|Gold finger bevelling tolerance||'+/-5 degree|
|Min space of gold finger chamfering||6mm|
|Min gap between the side of||8mil|
|Layer count||1~28 layer|
|PCB thickness tolerance˄Normal||Thickness : ±10%(＞1.0mm)；±0.1mm(≤1.0mm)；|
|PCB thickness tolerance˄Special ˅||Thickness ±0.1mm（≤2.0mm）；±0.15mm（2.1-3.0mm）|
|Controlled Impedance Tolerance||'+/-10%|
|Testing methods||Flying probe testing, Test fixture|
|Quality standards||IPC II, IPC III|
A PCB prototype is a pre-production version of a printed circuit board that is used to test and verify a circuit’s design before it is mass-produced. Prototyping is an important step in the PCB design process because it allows designers to identify and correct any issues with the circuit’s layout or functionality before it is finalized.
There are several different ways to create a PCB prototype, including:
- Using a prototyping board: A prototyping board, also known as a breadboard, is a type of PCB with a grid of holes that allows you to easily connect electronic components using jumper wires. This is a quick and simple way to test a circuit, but it is not suitable for permanent use as the connections are prone to coming loose.
- Using a PCB fabrication service: Another option is to use a PCB fabrication service to create a small batch of PCB prototypes. This typically involves uploading the PCB design to the service, selecting the desired materials and features, and then waiting for the prototypes to be delivered.
- Creating a PCB prototype by hand: For more experienced designers, it is also possible to create a PCB prototype by hand using a combination of etching and soldering techniques. This method allows you to create a fully functional PCB prototype, but it is more time consuming and requires more specialized equipment and skills.
Bring you better PCB products
Circuit Board Fabrication and PCB Assembly Turnkey Services
Frequently asked questions
Why create a PCB prototype?
How do I create a PCB prototype?
How much does it cost to create a PCB prototype?
How long does it take to create a PCB prototype?
Can I create a PCB prototype myself?
Why Choose Us?
WINOW has been providing high-quality PCBs with quick turnaround times and high customer satisfaction since 2018. We are one of China's largest and most skilled board manufacturers.
Typically, PCB prototypes and small-batch manufacturing take 5-7 working days.
Prototype orders are processed within 24 hours.
The lead time for small batch production and some PCB prototypes is 48 hours.
Flexible payment options
There is no minimum purchase or order amount. Orders for prototypes and mass production are both accepted.
Inspection Of Quality
90% of the technical staff has more than ten years of experience in the industry.
PCB Assembly can be adjusted at any time to meet customer requirements for ICT, veneer, aging, and ATE tests.